| PATENT REGISTER | |||||||||
| Status | Lapsed | Patent No. | 3038148 | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Application No. | 15201534.3 | Date of Filing | 21/12/2015 | ||||||
| Date Grant Published | 02/08/2017 | Application Published | 29/06/2016 | ||||||
| Title of Invention | WAFER TEMPORARY BONDING METHOD AND THIN WAFER MANUFACTURING METHOD | ||||||||
| Priority |
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| Inventors |
YASUDA, Hiroyuki SUGO, Michihiro TAGAMI, Shohei TANABE, Masahito |
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| Current Proprietor |
Shin-Etsu Chemical Co., Ltd. 6-1 Ohtemachi 2-chome Chiyoda-ku Tokyo JAPAN |
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| Publication Language | English | ||||||||
| Translation Received Date | |||||||||
| 31/08/2018 | Patent lapsed due to non-payment of Patent Renewal Fee in respect of year 3. | ||||||||
